Sequence numbers items parameters notes
1 maximum number of layers 44layers  
2 Min. line width 75 um /125um outer layer
18μm copper thickness:75μm

Inner layer

35μm copper thickness:100μm Inner layer
70μm copper thickness:170μm Inner layer
3 Min. spacing 75um outer layer
18μm copper thickness:50μm Inner layer
35μm copper thickness:75μm Inner layer
70μm copper thickness:100μm Inner layer
4 Min. annular ring 100um Inner layer
100um outer layer
5 Copper thickness 0.5~2OZ Inner layer
1~4OZ outer layer
6 Min. hole diameter 0.15mm  
7 Ratio of panel thickness ≦12:1  
8 Min. panel thickness 0.40mm  
9 Impedance control Tolerance of Impedance value±10%,min.±5%  
10 Tg value of panel 150-260°C  
11 Distance between line and edge of panel 0.2.mm  
12 Solder Mask Green solder mask window  0.100mm  
Green solder mask bridge 0.100mm
13 Min. line width  0.10mm  
14 through-hole plating ≥20um,local region18um IPC grade2
≥25um,local region 20um IPC grade 3
≥25um,local region 20um Military items
Average of 25-30um,not less than 20um at the thinnest point 上天件
15 Performance testing Characteristic impedance test  
Microsection  
Insulation resistance  
Dielectric strength  
Peel strength  
Testing of ion contamination  
solder ability test;  
thermal shock test  
Experiments under hygrothermal condition.  
layer thickness measurement  

 

Sequence numbers items parameters notes
1 maximum number of layers 4+N+4 Build up process / Plating bronze pillars
2 Diameter of bronze pillars Min.:65um/max:260um Plating bronze pillars
3 Min. line width 125um Outer layer/with through holes,substractive processing
75um Outer layer / without through holes,Additive processing
75um Inner layer
4 Undermost spacing 75um Outer layer/with through holes,substractive processing
50um Outer layer / without through holes,Additive processing
50um Inner layer
5 Min. annular ring 100um Outer layer/with through holes,substractive processing
50um Outer layer / without through holes,Additive processing
100um Inner layer
6 Impedance control Tolerance of Impedance value±10%,min.±5%  
7 Tg value of panel 150-260°C  
8 Distance between line and edge of panel 0.20mm  
9 Solder Mask Green solder mask window 0.100mm  
Green solder mask bridge 0.100mm
color Green, red, yellow, blue, black
10 Character Min. line width 0.10mm  
color White, yellow  
11 through-hole plating ≥20um,local region18um IPC grade2
≥25um,local region 20um IPC grade 3
≥25um,local region 20um Military items
Average of 25-30um,not less than 20um at the thinnest point 上天件
12 Performance testing Flying probe  
Characteristic impedance test  
Microsection  
Insulation resistance  
Dielectric strength  
Peel strength  
Testing of ion contamination  
Solder ability test;  
Thermal shock test  
Experiment under hygrothermal condition  
layer thickness measurement