| Sequence numbers | items | parameters | notes | |
| 1 | maximum number of layers | 44layers | ||
| 2 | Min. line width | 75 um /125um | outer layer | |
| 18μm copper thickness：75μm | Inner layer |
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| 35μm copper thickness：100μm | Inner layer | |||
| 70μm copper thickness：170μm | Inner layer | |||
| 3 | Min. spacing | 75um | outer layer | |
| 18μm copper thickness：50μm | Inner layer | |||
| 35μm copper thickness：75μm | Inner layer | |||
| 70μm copper thickness：100μm | Inner layer | |||
| 4 | Min. annular ring | 100um | Inner layer | |
| 100um | outer layer | |||
| 5 | Copper thickness | 0.5~2OZ | Inner layer | |
| 1~4OZ | outer layer | |||
| 6 | Min. hole diameter | 0.15mm | ||
| 7 | Ratio of panel thickness | ≦12：1 | ||
| 8 | Min. panel thickness | 0.40mm | ||
| 9 | Impedance control | Tolerance of Impedance value±10%，min.±5% | ||
| 10 | Tg value of panel | 150-260°C | ||
| 11 | Distance between line and edge of panel | 0.2.mm | ||
| 12 | Solder Mask | Green solder mask window | 0.100mm | |
| Green solder mask bridge | 0.100mm | |||
| 13 | Min. line width | 0.10mm | ||
| 14 | through-hole plating | ≥20um，local region18um | IPC grade2 | |
| ≥25um，local region 20um | IPC grade 3 | |||
| ≥25um，local region 20um | Military items | |||
| Average of 25-30um，not less than 20um at the thinnest point | 上天件 | |||
| 15 | Performance testing | Characteristic impedance test | ||
| Microsection | ||||
| Insulation resistance | ||||
| Dielectric strength | ||||
| Peel strength | ||||
| Testing of ion contamination | ||||
| solder ability test; | ||||
| thermal shock test | ||||
| Experiments under hygrothermal condition. | ||||
| layer thickness measurement | ||||
| Sequence numbers | items | parameters | notes | |
| 1 | maximum number of layers | 4+N+4 | Build up process / Plating bronze pillars | |
| 2 | Diameter of bronze pillars | Min.：65um/max：260um | Plating bronze pillars | |
| 3 | Min. line width | 125um | Outer layer/with through holes,substractive processing | |
| 75um | Outer layer / without through holes,Additive processing | |||
| 75um | Inner layer | |||
| 4 | Undermost spacing | 75um | Outer layer/with through holes,substractive processing | |
| 50um | Outer layer / without through holes，Additive processing | |||
| 50um | Inner layer | |||
| 5 | Min. annular ring | 100um | Outer layer/with through holes,substractive processing | |
| 50um | Outer layer / without through holes,Additive processing | |||
| 100um | Inner layer | |||
| 6 | Impedance control | Tolerance of Impedance value±10%，min.±5% | ||
| 7 | Tg value of panel | 150-260°C | ||
| 8 | Distance between line and edge of panel | 0.20mm | ||
| 9 | Solder Mask | Green solder mask window | 0.100mm | |
| Green solder mask bridge | 0.100mm | |||
| color | Green, red, yellow, blue, black | |||
| 10 | Character | Min. line width | 0.10mm | |
| color | White, yellow | |||
| 11 | through-hole plating | ≥20um，local region18um | IPC grade2 | |
| ≥25um，local region 20um | IPC grade 3 | |||
| ≥25um，local region 20um | Military items | |||
| Average of 25-30um，not less than 20um at the thinnest point | 上天件 | |||
| 12 | Performance testing | Flying probe | ||
| Characteristic impedance test | ||||
| Microsection | ||||
| Insulation resistance | ||||
| Dielectric strength | ||||
| Peel strength | ||||
| Testing of ion contamination | ||||
| Solder ability test; | ||||
| Thermal shock test | ||||
| Experiment under hygrothermal condition | ||||
| layer thickness measurement | ||||