• Total Thickness: 5.0mm or thicker
  • Size: 460mm×580mm or larger
  • Total layer: 44
  • Min. Line/Space: 75/75μm
  • Min. hole diameter: 0.30mm
  • Pulse plating
  • Via land diameter: 0.8mm
  • Material: FR-4, PI, BT
  • Surface treatment: OSP/ENIG/HASL
  • Control Impendence: 50±7%
  • RoHS Compliance
  • Lead Free & Halogen Free
  
  • Total Thickness: 3.5mm or thicker
  • Size: 510mm×560mm
  • Total layer: 29
  • Min. Line/Space: 75/75μm
  • Min. hole diameter: 0.30mm (TH)
  • Pulse plating
  • Via land diameter: 0.8mm
  • Material: FR-4, PI, BT
  • Surface treatment: OSP/ENIG/HASL
  • Control Impendence: 50±7%
  • RoHS Compliance
  • Lead Free & Halogen Free
  • Hole structure: Buried & Blind hole
  
  • Structure:4+12+4
  • Total Thickness: 2.2mm or thicker
  • Size: 440mm×420mm
  • Min. Line/Space: 50/50μm
  • Min. copper pillar diameter: 90μm
  • Stacked via
  • Via land diameter: 150μm
  • Bump pad pitch: 0.80mm
  • Material: PI, BT, ABF, High Tg Epoxy
  • Surface treatment: OSP/ENIG
  • Control Impendence: 50±7%
  • High Density Interconnection Boards
  
  • Total Thickness: 2.0mm or thicker
  • Size: 420mm×520mm
  • Total layer: 12
  • Total layer: 29
  • Min. Line/Space: 75/75μm
  • Min. hole diameter: 0.30mm (TH)
  • Pulse plating
  • Via land diameter: 0.8mm
  • Surface treatment: OSP/ENIG/HASL
  • Single-ended impedance 50±5%
  • Differential impedance 100±7%
  • Lead Free & Halogen Free
  • Hole structure: Buried & Blind hole
  
  • Structure:4+12+4
  • Total Thickness: 2.2mm or thicker
  • Size: 440mm×420mm
  • Min. Line/Space: 50/50μm
  • Min. copper pillar diameter: 90μm
  • Stacked via
  • Via land diameter: 150μm
  • Bump pad pitch: 0.80mm
  • Material: PI, BT, ABF, High Tg Epoxy
  • Surface treatment: OSP/ENIG
  • Control Impendence: 50±7%
  • High Density Interconnection Boards
  

1, Conventional technique(2+10+2layers,yield>99%)
Part of build-up layers
Inner layers: line width ≥4 mil, line spacing≥4 mil
Outer layers: line width ≥5 mil, line spacing≥5 mil
The smallest HDI hole (blind /buried hole) 0.15 mm, bonding pad of the smallest HDI hole≥0.25mm
Part of base layers:
Line width≥5mil, line spacing ≥ 5mil, the smallest drill hole (through hole)10 mil, bonding pad≥18mil
2,Mature technique(3+12+3 layers,yield>95%)
Part of build-up layers
Inner layers: line width ≥3 mil, line spacing≥3 mil
Outer layers: line width ≥4 mil, line spacing≥4 mil
The smallest HDI hole (blind /buried hole) 0.1 mm, bonding pad of the smallest HDI hole≥0.18mm
Part of base layers:
Line width≥4mil, line spacing ≥ 4mil, the smallest drill hole (through hole) 10 mil, bonding pad≥18mil
3,The highest technique(4+14+4layers,yield>90%)
Part of build-up layers
Inner layers: line width ≥2 mil, line spacing≥2 mil
Outer layers: line width ≥3 mil, line spacing≥3 mil
The smallest HDI hole (blind /buried hole) 0.065 mm, bonding pad of the smallest HDI hole≥0.125mm
Part of base layers:

Line width≥3mil, line spacing ≥ 3mil, the smallest drill hole (through hole) 10 mil, bonding pad≥18mil