
一.常规工艺(2+10+2层,成品率>99%):
构造层(Build-up layers)部分:
内层:线宽≥4mil,线间距≥4mil
外层:线宽≥5mil,线间距≥5mil
最小HDI孔(埋盲孔)0.15mm,最小HDI孔焊盘≥0.25mm
基板层(Base layers)部分:
线宽≥5mil,线间距≥5mil,最小钻孔(通孔)10mil,焊盘≥18mil
二.成熟工艺(3+12+3层,成品率>95%):
构造层(Build-up layers)部分:
内层:线宽≥3mil,线间距≥3mil
外层:线宽≥4mil,线间距≥4mil
最小HDI孔(埋盲孔)0.1mm,最小HDI孔焊盘≥0.18mm
基板层(Base layers)部分:
线宽≥4mil,线间距≥4mil,最小钻孔(通孔)10mil,焊盘≥18mil
三.最高工艺(4+14+4层,成品率>90%):
构造层(Build-up layers)部分:
内层:线宽≥2mil,线间距≥2mil
外层:线宽≥3mil,线间距≥3mil
最小HDI孔(埋盲孔)0.065mm,最小HDI孔焊盘≥0.125mm
基板层(Base layers)部分:
线宽≥3mil,线间距≥3mil,最小钻孔(通孔)10mil,焊盘≥18mil